The 74FCT163374 16-bit high-speed, low-power edge-triggered D-type register is ideal for use as buffer registers for data synchronization and storage. The Output Enable (xOE) and clock (xCLK) controls are organized to operate each device as two 8-bit or one 16-bit register with common clock. The inputs of 74FCT163374 can be driven from either 3.3V or 5V devices which allows use as translators in a mixed 3.3V/ 5V supply system. The 74FCT163374 operates at -40C to +85C

特性

  • A and C speeds
  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 3.3V ± 0.3V, Normal Range, or VCC = 2.7V to 3.6V, Extended Range
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-rail output swing for increased noise margin
  • Low Ground Bounce (0.3V typ.)
  • Inputs (except I/O) can be driven by 3.3V or 5V components
  • Available in 48 pin SSOP and TSSOP packages

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active TSSOP 48 C 是的 Tube
Availability
Active TSSOP 48 C 是的 Reel
Availability
Active SSOP 48 C 是的 Tube
Availability
Active SSOP 48 C 是的 Reel
Availability
Active TSSOP 48 C 是的 Tube
Availability
Active TSSOP 48 C 是的 Reel
Availability
Active SSOP 48 C 是的 Tube
Availability
Active SSOP 48 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
74FCT163374 Datasheet 数据手册 PDF 142 KB
应用指南 &白皮书
AN-116: Decoupling Double Density Components 应用文档 PDF 96 KB
AN-124: 3.3V Logic Characteristics 应用文档 PDF 172 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities 产品变更通告 PDF 157 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 333 KB
PCN# : A1506-02 Gold wire to Copper wire 产品变更通告 PDF 35 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 291 KB
PCN# : A1504-04 Assembly Transfer from Amkor Philippines to OSE Taiwan 产品变更通告 PDF 484 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 产品变更通告 PDF 129 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed 产品变更通告 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) 产品变更通告 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material 产品变更通告 PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound 产品变更通告 PDF 48 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# G-0110-06 Mold Compound 产品变更通告 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 产品变更通告 PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PDN# Logic-00-07: Obsolete Selective Speed Grades 产品删除通告 PDF 14 KB
PCN# L9910-03R1: Die revision, N or L to X 产品变更通告 PDF 12 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
Downloads
74FCT163374 Hspice Model 模型 - HSPICE ZIP 12 KB
74FCT163374 IBIS Model 模型 - IBIS ZIP 10 KB