70T3589S133BFI8 Quick Packaging Info

Active

Title Information
Product Number: 70T3589S133BFI8
Pkg. Description: CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Pkg. Code: BF208
Lead Count: 208
Length: 15
Width: 15
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Category: 240
Pb (Lead) Free: No
JEDEC Standard: MO-205
Title Information
Carrier Type: Reel
Qty. per Carrier: 0
Pkg. Type: CABGA
Qty. per Reel: 1000
Reel Size: 13
Tape Pin 1 Quad: 1
Tape Pocket Pitch: 20
Moisture Sensitivity Level (MSL): 3
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0