89H24NT6AG2ZBHLGI Quick Packaging Info

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Title Information
Product Number: 89H24NT6AG2ZBHLGI
Pkg. Description: FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Pkg. Code: HLG484
Lead Count: 484
Length: 23
Width: 23
Thickness: 2.9
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: G
Pb (Lead) Free: Yes
Title Information
Carrier Type: Tray
Qty. per Carrier: 60
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 250
Pb Free Category: e1 SnAgCu