89H64H16AG2ZCBLI Quick Packaging Info

Obsolete

Title Information
Product Number: 89H64H16AG2ZCBLI
Pkg. Description: FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH
Pkg. Code: BL1156
Lead Count: 1156
Length: 35
Width: 35
Thickness: 2.8
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: 240
Pb (Lead) Free: No
Title Information
Carrier Type: Tray
Qty. per Carrier: 24
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0