Title Information
Package Description CHIP ARRAY BGA 8.0 X 8.0 MM X 0.8 MM PIT
Package Status Active
Package Type CABGA
Class PLASTIC
Package Code BFG81
Category G
Lead Count 81
Pb (Lead) Free Yes
Length 8mm
Pb Free Category e1 SnAgCu
Width 8mm
Thickness 1.35mm
Peak Reflow Temp 260.00°C
Pitch 0.8mm
Package Carrier Reel, Tray
Pkg. Dimensions 8.0 x 8.0 x 1.35

Documentation

Title Other Languages Type Format File Size Date
Other
Recommended Reflow Profile Product/Marketing PDF 135 KB
81-FPBGA Package Outline Drawing
8.0 x 8.0 x 1.35 mm Body, 0.8mm Pitch,
BF/BFG81D1
Package Outline Drawing PDF 91 KB
BF/BFG81 SHIPPING TRAY Carrier / Package Type PDF 125 KB
BFG81 Copper IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB
BFG81 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 250 KB
BFG81 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 318 KB
BFG81 Copper Wire IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 318 KB