Title Information
Package Description FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code BLG1156
Category G
Lead Count 1156
Pb (Lead) Free Yes
Length 35mm
Pb Free Category e1 SnAgCu
Width 35mm
Thickness 2.82mm
Peak Reflow Temp 245.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions (mm) 35.0 x 35.0 x 2.82

Documentation

Title Other Languages Type Format File Size Date
Other
Recommended Reflow Profile Product/Marketing PDF 135 KB
BL/BLG/BLH/BR1156 SHIPPING TRAY Carrier / Package Type PDF 101 KB
BL/BR PACKAGE OUTLINE 35.0 X 35.0mm BODY 1.0 mm BALLPITCH FCBGA Package Outline Drawing PDF 312 KB
BLG1156 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 289 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB
BLG1156 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 250 KB