Title | Information |
---|---|
Package Description | FLIP CHIP BGA 31X31 MM X 1.0 MM PITCH |
Package Status | Active |
Package Type | FCBGA |
Class | PLASTIC |
Package Code | BLG896 |
Category | G |
Lead Count | 896 |
Pb (Lead) Free | Yes |
Length | 31mm |
Pb Free Category | e1 SnAgCu |
Width | 31mm |
Thickness | 2.67mm |
Peak Reflow Temp | 245.00°C |
Pitch | 1mm |
Package Carrier | Tray |
Pkg. Dimensions | 31.0 x 31.0 x 2.67 |
Title | Other Languages | Type | Format | File Size | Date | |
---|---|---|---|---|---|---|
Other | ||||||
Recommended Reflow Profile | – | Product/Marketing | 135 KB | Feb 14, 2019 | ||
896-FCBGA, Package Outline Drawing 31.0 x 31.0 x 2.674 mm Body, 1.0mm Pitch BLG896D1 |
– | Package Outline Drawing | 175 KB | Nov 1, 2017 |