| Title | Information |
|---|---|
| Package Description | FLIP CHIP BGA 31X31 MM X 1.0 MM PITCH |
| Package Status | Active |
| Package Type | FCBGA |
| Class | PLASTIC |
| Package Code | BLG896 |
| Category | G |
| Lead Count | 896 |
| Pb (Lead) Free | Yes |
| Length | 31mm |
| Pb Free Category | e1 SnAgCu |
| Width | 31mm |
| Thickness | 2.67mm |
| Peak Reflow Temp | 245.00°C |
| Pitch | 1mm |
| Package Carrier | Tray |
| Pkg. Dimensions (mm) | 31.0 x 31.0 x 2.67 |
| Title | Other Languages | Type | Format | File Size | Date | |
|---|---|---|---|---|---|---|
| Other | ||||||
| Recommended Reflow Profile | – | Product/Marketing | 135 KB | |||
| 896-FCBGA, Package Outline Drawing 31.0 x 31.0 x 2.674 mm Body, 1.0mm Pitch BLG896D1 |
– | Package Outline Drawing | 175 KB | |||
