Title | Information |
---|---|
Package Description | TQFP 20.0 X 20.0 X 1.4 MM |
Package Status | Active |
Package Type | TQFP |
Class | PLASTIC |
Package Code | DA144 |
Category | 240 |
Lead Count | 144 |
Pb (Lead) Free | No |
Length | 20mm |
Pb Free Category | e0 |
Width | 20mm |
Thickness | 1.4mm |
Peak Reflow Temp | 225.00°C |
Pitch | 0.5mm |
Package Carrier | Reel, Tray |
Pkg. Dimensions | 20.0 x 20.0 x 1.4 |
Title | Other Languages | Type | Format | File Size | Date | |
---|---|---|---|---|---|---|
PCNs & PDNs | ||||||
PCN# A0710-01, UTAC-Singapore | – | Product Change Notification | 100 KB | Nov 11, 2007 | ||
PCN# : TB0609-03R2 Pin 1 Orientation in Tape & Reel Change | – | Product Change Notification | 376 KB | Jul 25, 2007 | ||
PCN# : TB0609-03R1 Pin 1 Orientation in Tape & Reel Change | – | Product Change Notification | 178 KB | Jan 11, 2007 | ||
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP | – | Product Change Notification | 252 KB | Oct 18, 2006 | ||
Other | ||||||
Recommended Reflow Profile | – | Product/Marketing | 135 KB | Feb 14, 2019 | ||
DA/DAG144/176,DD/DDG144 & EK/EKG144 SHIPPING TRAY | – | Carrier / Package Type | 115 KB | Feb 9, 2017 | ||
DA/DAG PACKAGE OUTLINE 20.0 X 20.0 X 1.4 mm TQFP 1.00/.10 FORM | – | Package Outline Drawing | 190 KB | Jul 15, 2013 | ||
DA144 IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 250 KB | Apr 6, 2009 | ||
DA144 IPC-1752-2 v1.01 Class 6 (MCD) | – | Materials Composition Declaration | 258 KB | Apr 6, 2009 | ||
QFP FINAL MOUNTING INSTRUCTION | – | Work Instruction | DOC | 372 KB | Dec 31, 0000 |