| Title | Information |
|---|---|
| Package Description | TQFP 20.0 X 20.0 X 1.4 MM |
| Package Status | Active |
| Package Type | TQFP |
| Class | PLASTIC |
| Package Code | DA144 |
| Category | 240 |
| Lead Count | 144 |
| Pb (Lead) Free | No |
| Length | 20mm |
| Pb Free Category | e0 |
| Width | 20mm |
| Thickness | 1.4mm |
| Peak Reflow Temp | 225.00°C |
| Pitch | 0.5mm |
| Package Carrier | Reel, Tray |
| Pkg. Dimensions | 20.0 x 20.0 x 1.4 |
| Title | Other Languages | Type | Format | File Size | Date | |
|---|---|---|---|---|---|---|
| PCNs & PDNs | ||||||
| PCN# A0710-01, UTAC-Singapore | – | Product Change Notification | 100 KB | Nov 11, 2007 | ||
| PCN# : TB0609-03R2 Pin 1 Orientation in Tape & Reel Change | – | Product Change Notification | 376 KB | Jul 25, 2007 | ||
| PCN# : TB0609-03R1 Pin 1 Orientation in Tape & Reel Change | – | Product Change Notification | 178 KB | Jan 11, 2007 | ||
| PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP | – | Product Change Notification | 252 KB | Oct 18, 2006 | ||
| Other | ||||||
| DA/DAG144/176,DD/DDG144 & EK/EKG144 SHIPPING TRAY | – | Carrier / Package Type | 115 KB | Feb 9, 2017 | ||
| DA/DAG PACKAGE OUTLINE 20.0 X 20.0 X 1.4 mm TQFP 1.00/.10 FORM | – | Package Outline Drawing | 190 KB | Jul 15, 2013 | ||
| DA144 IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 250 KB | Apr 6, 2009 | ||
| DA144 IPC-1752-2 v1.01 Class 6 (MCD) | – | Materials Composition Declaration | 258 KB | Apr 6, 2009 | ||
| IDT User Recommended Reflow Profile (Standard 225C) | – | Reflow Profile | 94 KB | Jan 30, 2008 | ||
| QFP FINAL MOUNTING INSTRUCTION | – | Work Instruction | DOC | 372 KB | Dec 31, 0000 | |
