Title Information
Package Description FLIP CHIP BGA 19 X 19 MM 0.8 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code HMG484
Category G
Lead Count 484
Pb (Lead) Free Yes
Length 19mm
Pb Free Category e1 SnAgCu
Width 19mm
Thickness 1.89mm
Peak Reflow Temp 260.00°C
Pitch 0.8mm
Package Carrier Reel
Pkg. Dimensions (mm) 19.0 x 19.0 x 1.89