HMG675 (FCBGA 675)

Title Information
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code HMG675
Category G
Lead Count 675
Pb (Lead) Free Yes
Length 27mm
Pb Free Category e1 SnAgCu
Width 27mm
Thickness 2.41mm
Peak Reflow Temp 245.00°C
Pitch 1mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 27 x 27 x 2.41

Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
HM/RM 1023 PACKAGE OUTLINE 33 x 33 mm BODY 1.00 mm PITCH FCBGA Package Outline Drawing PDF 220 KB Jun 17, 2013
Other
BB/BBG416, BG/BGG256/272, BH/BHG580/675, BL/BLG676, BR672/676, BX/BXG420, HL/HLG/HMG/RM676 & HM/HMG/HMH/RM675 SHIPPING TRAY Carrier / Package Type PDF 95 KB Dec 14, 2016