Title Information
Package Description SOIC 300 MIL
Package Status Active
Package Type SOIC
Class PLASTIC
Package Code PS18
Category 240
Lead Count 18
Pb (Lead) Free No
Length 11.5mm
Pb Free Category e0
Width 7.6mm
Thickness 2.34mm
Peak Reflow Temp 225.00°C
Pitch 1.27mm
Package Carrier Tube
Pkg. Dimensions (mm) 11.5 x 7.6 x 2.34

Documentation

Title Other Languages Type Format File Size Date
PCNs & PDNs
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notification PDF 147 KB
PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility Product Change Notification PDF 490 KB
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil Product Change Notification PDF 223 KB
PCN# L-0607-01R1 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 379 KB
PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 305 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notification PDF 298 KB
Other
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
SOIC MARKETING DRAWING (.050" PITCH) (EIAJ) Package Outline Drawing PDF 134 KB
PS/PSG/PI/PIG PACKAGE OUTLINE .300" BODY WIDTH SOIC .050" PITCH Carrier / Package Type PDF 159 KB
PS18 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 1 KB
PS18 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 1 KB