Title Information
Package Description FLIP CHIP BGA 24.5 X 19.5 MM 0.80 MM PIT
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code RJ655
Category RoHS
Lead Count 655
Pb (Lead) Free No
Length 24.5mm
Pb Free Category e1 SnAgCu
Width 19.5mm
Thickness 2.55mm
Peak Reflow Temp 245.00°C
Pitch 0.8mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 24.5 x 19.5 x 2.55

Documentation

Title Other Languages Type Format File Size Date
PCNs & PDNs
PCN# : TB0803-01 Change of HIC Card – Product Change Notification PDF 967 KB
PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB – Product Change Notification PDF 88 KB
PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products – Product Change Notification PDF 90 KB
A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA – Product Change Notification PDF 21 KB
Other
Recommended Reflow Profile – Product/Marketing PDF 135 KB
Quadrant 2 Loading Orientation in Reel form – Carrier / Package Type PDF 141 KB
13" PLASTIC REEL WITH 4" HUB – Carrier / Package Type PDF 53 KB
COVER TAPE – Carrier / Package Type PDF 28 KB
BJ/BJG/RJ655 SHIPPING TRAY – Carrier / Package Type PDF 283 KB
BJ/BJG/HJ/HJG/RH/RJ 655 CARRIER TAPE – Carrier / Package Type PDF 30 KB
BJ/RJ/BJG 655 PACKAGE OUTLINE 24.5X19.5mm BODY 0.80mm PITCH FCBGA – Package Outline Drawing PDF 1.02 MB
RJ655 IPC-1752-2 v1.01 Class 6 (MCD) – Materials Composition Declaration PDF 916 KB
RJ655 IPC 1752-1 v1.01 Class 4 (MCD) – Materials Composition Declaration PDF 533 KB
info: For device-specific or order-specific documentation, submit a support request.