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RJ655 (FCBGA 655)
Title | Information |
---|---|
Package Description | FLIP CHIP BGA 24.5 X 19.5 MM 0.80 MM PIT |
Package Status | Active |
Package Type | FCBGA |
Class | PLASTIC |
Package Code | RJ655 |
Category | RoHS |
Lead Count | 655 |
Pb (Lead) Free | No |
Length | 24.5mm |
Pb Free Category | e1 SnAgCu |
Width | 19.5mm |
Thickness | 2.55mm |
Peak Reflow Temp | 245.00°C |
Pitch | 0.8mm |
Package Non-Reel Carrier | TRAY |
Pkg. Dimensions | 24.5 x 19.5 x 2.55 |
Documentation
Title | Other Languages | Type | Format | File Size | Date | |
---|---|---|---|---|---|---|
Datasheets & Errata | ||||||
BJ/RJ/BJG 655 PACKAGE OUTLINE 24.5X19.5mm BODY 0.80mm PITCH FCBGA | – | Package Outline Drawing | 1.02 MB | Jun 20, 2013 | ||
HJ/RH/HJG 655 PACKAGE OUTLINE 24.5 x 19.5 mm BODY 0.80 mm PITCH FCBGA | – | Package Outline Drawing | 240 KB | Jun 20, 2013 | ||
PCNs & PDNs | ||||||
PCN# : TB0803-01 Change of HIC Card | – | Product Change Notification | 967 KB | May 7, 2008 | ||
PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB | – | Product Change Notification | 88 KB | Oct 8, 2006 | ||
PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products | – | Product Change Notification | 90 KB | Jul 17, 2006 | ||
A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA | – | Product Change Notification | 21 KB | May 10, 2006 | ||
Other | ||||||
Quadrant 2 Loading Orientation in Reel form | – | Carrier / Package Type | 141 KB | Feb 20, 2017 | ||
13" PLASTIC REEL WITH 4" HUB | – | Carrier / Package Type | 53 KB | Feb 14, 2017 | ||
COVER TAPE | – | Carrier / Package Type | 28 KB | Feb 9, 2017 | ||
BJ/BJG/RJ655 SHIPPING TRAY | – | Carrier / Package Type | 283 KB | Dec 22, 2016 | ||
BJ/BJG/HJ/HJG/RH/RJ 655 CARRIER TAPE | – | Carrier / Package Type | 30 KB | Nov 14, 2015 | ||
RJ655 IPC-1752-2 v1.01 Class 6 (MCD) | – | Materials Composition Declaration | 916 KB | Apr 23, 2008 | ||
IDT User Recommended Reflow Profile (RoHS 245C) | – | Reflow Profile | 86 KB | Jan 30, 2008 | ||
RJ655 IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 533 KB | Jan 9, 2008 |