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RJ655 (FCBGA 655)
| Title | Information |
|---|---|
| Package Description | FLIP CHIP BGA 24.5 X 19.5 MM 0.80 MM PIT |
| Package Status | Active |
| Package Type | FCBGA |
| Class | PLASTIC |
| Package Code | RJ655 |
| Category | RoHS |
| Lead Count | 655 |
| Pb (Lead) Free | No |
| Length | 24.5mm |
| Pb Free Category | e1 SnAgCu |
| Width | 19.5mm |
| Thickness | 2.55mm |
| Peak Reflow Temp | 245.00°C |
| Pitch | 0.8mm |
| Package Non-Reel Carrier | TRAY |
| Pkg. Dimensions | 24.5 x 19.5 x 2.55 |
Documentation
| Title | Other Languages | Type | Format | File Size | Date | |
|---|---|---|---|---|---|---|
| Datasheets & Errata | ||||||
| BJ/RJ/BJG 655 PACKAGE OUTLINE 24.5X19.5mm BODY 0.80mm PITCH FCBGA | – | Package Outline Drawing | 1.02 MB | Jun 20, 2013 | ||
| HJ/RH/HJG 655 PACKAGE OUTLINE 24.5 x 19.5 mm BODY 0.80 mm PITCH FCBGA | – | Package Outline Drawing | 240 KB | Jun 20, 2013 | ||
| PCNs & PDNs | ||||||
| PCN# : TB0803-01 Change of HIC Card | – | Product Change Notification | 967 KB | May 7, 2008 | ||
| PCN# : A0609-01 Addition of SPIL, Taiwan as an Alternate Assembly Facility for AMB | – | Product Change Notification | 88 KB | Oct 8, 2006 | ||
| PCN# A-0605-01R1 Amkor Taiwan as Alternate Assembly and KYEC Taiwan as Alternate Test Facility for AMB Products | – | Product Change Notification | 90 KB | Jul 17, 2006 | ||
| A-0605-01 AMKOR Taiwan as Alternate Assembly Facility for 655L FCBGA | – | Product Change Notification | 21 KB | May 10, 2006 | ||
| Other | ||||||
| Quadrant 2 Loading Orientation in Reel form | – | Carrier / Package Type | 141 KB | Feb 20, 2017 | ||
| 13" PLASTIC REEL WITH 4" HUB | – | Carrier / Package Type | 53 KB | Feb 14, 2017 | ||
| COVER TAPE | – | Carrier / Package Type | 28 KB | Feb 9, 2017 | ||
| BJ/BJG/RJ655 SHIPPING TRAY | – | Carrier / Package Type | 283 KB | Dec 22, 2016 | ||
| BJ/BJG/HJ/HJG/RH/RJ 655 CARRIER TAPE | – | Carrier / Package Type | 30 KB | Nov 14, 2015 | ||
| RJ655 IPC-1752-2 v1.01 Class 6 (MCD) | – | Materials Composition Declaration | 916 KB | Apr 23, 2008 | ||
| IDT User Recommended Reflow Profile (RoHS 245C) | – | Reflow Profile | 86 KB | Jan 30, 2008 | ||
| RJ655 IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 533 KB | Jan 9, 2008 | ||