| Title | Information |
|---|---|
| Package Description | FLIP CHIP BGA 33MM X 33MM 1.0 MM PITCH |
| Package Status | Active |
| Package Type | FCBGA |
| Class | PLASTIC |
| Package Code | RM1023 |
| Category | RoHS |
| Lead Count | 1023 |
| Pb (Lead) Free | No |
| Length | 33mm |
| Pb Free Category | e1 SnAgCu |
| Width | 33mm |
| Thickness | 2mm |
| Peak Reflow Temp | 260.00°C |
| Pitch | 1mm |
| Package Carrier | Tray |
| Pkg. Dimensions (mm) | 33.0 x 33.0 x 2.0 |
| Title | Other Languages | Type | Format | File Size | Date | |
|---|---|---|---|---|---|---|
| Other | ||||||
| Recommended Reflow Profile | – | Product/Marketing | 135 KB | |||
| HC/RC503 & HM/RM1023 SHIPPING TRAY | – | Carrier / Package Type | 98 KB | |||
| HM/RM 1023 PACKAGE OUTLINE 33 x 33 mm BODY 1.00 mm PITCH FCBGA | – | Package Outline Drawing | 220 KB | |||
| RM1023 IPC-1752-2 v1.1 Class 6 (MCD) | – | Materials Composition Declaration | 293 KB | |||
| RM1023 IPC 1752-1 v1.1 Class 4 (MCD) | – | Materials Composition Declaration | 250 KB | |||
