Title Information
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code RM675
Category RoHS
Lead Count 675
Pb (Lead) Free No
Length 27mm
Pb Free Category e1 SnAgCu
Width 27mm
Thickness 2.41mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions (mm) 27.0 x 27.0 x 2.41

Documentation

Title Other Languages Type Format File Size Date
Other
Recommended Reflow Profile Product/Marketing PDF 135 KB
BB/BBG416, BG/BGG256/272, BH/BHG580/675, BL/BLG676, BR672/676, BX/BXG420, HL/HLG/HMG/RM676 & HM/HMG/HMH/RM675 SHIPPING TRAY Carrier / Package Type PDF 95 KB
HM/RM 1023 PACKAGE OUTLINE 33 x 33 mm BODY 1.00 mm PITCH FCBGA Package Outline Drawing PDF 220 KB
RM675 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB
RM675 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 293 KB