RM675 (FCBGA 675)

Title Information
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code RM675
Category RoHS
Lead Count 675
Pb (Lead) Free No
Length 27mm
Pb Free Category e1 SnAgCu
Width 27mm
Thickness 2.41mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 27 x 27 x 2.41

Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
HM/RM 675 PACKAGE OUTLINE 27 x 27 mm BODY 1.00 mm PITCH FCBGA Package Outline Drawing PDF 447 KB Jun 17, 2013
Other
BB/BBG416, BG/BGG256/272, BH/BHG580/675, BL/BLG676, BR672/676, BX/BXG420, HL/HLG/HMG/RM676 & HM/HMG/HMH/RM675 SHIPPING TRAY Carrier / Package Type PDF 95 KB Dec 14, 2016
RM675 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Sep 6, 2009
RM675 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 293 KB Sep 6, 2009