3.3V Zero Delay Low Skew Buffer

The 2305 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on IDT's proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides four low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2305 is available in two different versions. The 2305-1 is the base part. The 2305-1H is a high drive version with faster rise and fall times.

Features

  • Clock outputs from 10 to 133 MHz
  • Zero input-output delay
  • Four low skew (<250 ps) outputs
  • Device-to-device skew <700 ps
  • Full CMOS outputs with 25 mA output drive capability at TTL levels
  • 5 V tolerant CLKIN
  • Tri-state mode for board-level testing
  • Advanced, low power, sub-micron CMOS process
  • Operating voltage of 3.3 V
  • Industrial temperature range available
  • Packaged in 8-pin SOIC

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
2305-1DCG Active DCG8 SOIC 8 C Yes Tube Availability
2305-1DCG8 Active DCG8 SOIC 8 C Yes Reel Availability
2305-1DCGI Active DCG8 SOIC 8 I Yes Tube Availability
2305-1DCGI8 Active DCG8 SOIC 8 I Yes Reel Availability
2305-1HDCG Active DCG8 SOIC 8 C Yes Tube Availability
2305-1HDCG8 Active DCG8 SOIC 8 C Yes Reel Availability
2305-1HDCGI Active DCG8 SOIC 8 I Yes Tube Availability
2305-1HDCGI8 Active DCG8 SOIC 8 I Yes Reel Availability
2305M-1LF Active DCG8 SOIC 8 C Yes Tube Availability
2305M-1LFT Active DCG8 SOIC 8 C Yes Reel Availability
2305MI-1HLF Active DCG8 SOIC 8 I Yes Tube Availability
2305MI-1HLFT Active DCG8 SOIC 8 I Yes Reel Availability
2305MI-1LF Active DCG8 SOIC 8 I Yes Tube Availability
2305MI-1LFT Active DCG8 SOIC 8 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
2305 Datasheet Datasheet PDF 140 KB Aug 15, 2012
Application Notes & White Papers
AN-828 Termination - LVPECL Application Note PDF 229 KB Jul 5, 2016
AN-815 Understanding Jitter Units Application Note PDF 476 KB Apr 23, 2014
AN-845 Termination - LVCMOS Application Note PDF 62 KB May 12, 2014
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 82 KB May 12, 2014
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 403 KB May 11, 2014
AN-840 Jitter Specifications for Timing Signals Application Note PDF 349 KB May 7, 2014
AN-834 Hot-Swap Recommendations Application Note PDF 67 KB May 5, 2014
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.06 MB Apr 23, 2014
AN-805 Recommended Ferrite Beads Application Note PDF 38 KB Jan 14, 2014
AN-804 IDT Clock Buffers Offer Low Additive Phase Jitter Application Note PDF 162 KB Jan 14, 2014
AN-82 Clock Distribution with Guaranteed Skew Application Note PDF 146 KB May 31, 1996
AN-229: Zero Delay Buffers Application Note PDF 67 KB Jan 26, 2011
PCNs & PDNs
PDN# : CQ-17-04 Product Discontinuance Notice Product Discontinuation Notice PDF 599 KB Aug 24, 2017
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1504-01R1 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 95 KB Oct 21, 2015
PCN# : TB1504-01 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 50 KB Jul 20, 2015
PCN# : A1403-03 Gold wire to Copper wire Product Change Notice PDF 42 KB Oct 14, 2014
PCN# : TB1303-02 Change of Tape & Reel Packing Method for Selective Products Product Change Notice PDF 361 KB Mar 23, 2013
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB Dec 20, 2012
PCN# : A1208-06 Changed of Assembly Location and Crystal Product Change Notice PDF 1.06 MB Nov 17, 2012
PCN# : TB0904-02 QUALIFIED TEST LOCATIONS FOR MICRO CLOCK PRODUCTS Product Change Notice PDF 269 KB Apr 29, 2009
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN # A-0406-06 Qualify OSE Philippines for SOIC Product Change Notice PDF 100 KB Jun 30, 2004
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN # L-0501-03 Die Revision Change from CD/CD4 to Z Product Change Notice PDF 156 KB Feb 3, 2005
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
Other
The IDT Consumer Products Advantage Overview PDF 4.01 MB Jun 30, 2017
The IDT Automotive Advantage Overview PDF 3.55 MB May 26, 2017
The IDT Communications Products Advantage Overview PDF 2.54 MB Feb 13, 2017
IDT Clock Generation Overview 日本語 Overview PDF 1.83 MB Apr 28, 2016
IDT Clock Distribution Overview 日本語 Overview PDF 3.79 MB Apr 24, 2016

Software & Tools

Title Other Languages Type Format File Size Date
2305 Hspice Model Model - HSPICE ZIP 88 KB Feb 27, 2001
2305 IBIS Model Model - IBIS ZIP 24 KB Sep 19, 2005

News & Additional Resources