3.3V Zero Delay Low Skew Buffer

The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 2309-1 is the base part. The 2309-1H is a high drive version with faster rise and fall times.

Features

  • Clock outputs from 10 to 133 MHz
  • Zero input-output delay
  • Nine low skew (<250 ps) outputs
  • Device-to-device skew <700 ps
  • Full CMOS outputs with 12 mA output drive capability at TTL levels
  • 5 V tolerant CLKIN
  • Tri-state mode for board-level testing
  • Advanced, low power, sub-micron CMOS process
  • Operating voltage of 3.3 V
  • Industrial temperature range available
  • Packaged in 16-pin SOIC and TSSOP (-1H version only)
  • RoHS 5 (green) or RoHS 6 (green and lead free) complaint packaging

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
2309-1DCG Active DCG16 SOIC 16 C Yes Tube Availability
2309-1DCG8 Active DCG16 SOIC 16 C Yes Reel Availability
2309-1DCGI Active DCG16 SOIC 16 I Yes Tube Availability
2309-1DCGI8 Active DCG16 SOIC 16 I Yes Reel Availability
2309-1HDCG Active DCG16 SOIC 16 C Yes Tube Availability
2309-1HDCG8 Active DCG16 SOIC 16 C Yes Reel Availability
2309-1HDCGI Active DCG16 SOIC 16 I Yes Tube Availability
2309-1HDCGI8 Active DCG16 SOIC 16 I Yes Reel Availability
2309-1HPGG Active PGG16 TSSOP 16 C Yes Tube Availability
2309-1HPGG8 Active PGG16 TSSOP 16 C Yes Reel Availability
2309-1HPGGI Active PGG16 TSSOP 16 I Yes Tube Availability
2309-1HPGGI8 Active PGG16 TSSOP 16 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
2309 Datasheet Datasheet PDF 120 KB Aug 15, 2012
Application Notes & White Papers
AN-828 Termination - LVPECL Application Note PDF 229 KB Jul 5, 2016
AN-845 Termination - LVCMOS Application Note PDF 62 KB May 12, 2014
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 82 KB May 12, 2014
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 403 KB May 11, 2014
AN-840 Jitter Specifications for Timing Signals Application Note PDF 349 KB May 7, 2014
AN-834 Hot-Swap Recommendations Application Note PDF 67 KB May 5, 2014
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.06 MB Apr 23, 2014
AN-815 Understanding Jitter Units Application Note PDF 476 KB Apr 23, 2014
AN-805 Recommended Ferrite Beads Application Note PDF 38 KB Jan 14, 2014
AN-229: Zero Delay Buffers Application Note PDF 67 KB Jan 26, 2011
AN-82 Clock Distribution with Guaranteed Skew Application Note PDF 146 KB May 31, 1996
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1403-01 Changed in Carrier Tape, Plastic Reel and Quantity per Reel on TSSOP-14, TSSOP-16 Product Change Notice PDF 663 KB Apr 7, 2014
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB Dec 20, 2012
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# : A1204-01R1 Revised Notification to Remove Selective Devices from TSSOP-16 Product Change Notice PDF 332 KB Oct 1, 2012
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN # L-0501-03 Die Revision Change from CD/CD4 to Z Product Change Notice PDF 156 KB Feb 3, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 21, 2004
PCN # A-0406-06 Qualify OSE Philippines for SOIC Product Change Notice PDF 100 KB Jun 30, 2004
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
Other
The IDT Communications Products Advantage Overview PDF 4.00 MB Mar 21, 2018
The IDT Consumer Products Advantage Overview PDF 4.01 MB Jun 30, 2017
The IDT Automotive Advantage 日本語 Overview PDF 3.55 MB May 26, 2017
IDT Clock Generation Overview 日本語 Overview PDF 1.83 MB Apr 28, 2016
IDT Clock Distribution Overview 日本語 Overview PDF 3.79 MB Apr 24, 2016

Software & Tools

Title Other Languages Type Format File Size Date
2309 IBIS Model Model - IBIS ZIP 31 KB Sep 19, 2005
2309 Hspice Model Model - HSPICE ZIP 89 KB Feb 27, 2001