Low-Voltage 24-Bit Bus Exchange Switch

The 74CBTLV16212 provides a set of 24 high-speed switches for bus exchanging and switching with low ON resistance, resulting in under 250ps propagation delay through the switch. The 74CBTLV16212 operates as a single 24-bit bus switch or as a 12-bit bus exchanger. The 74CBTLV16212 operates at -40C to +85C

Features

  • 5 ohm A/B bi-directional switch
  • Isolation Under Power-Off Conditions
  • Over-voltage tolerant
  • Latch-up performance exceeds 100mA
  • VCC = 2.3V - 3.6V, normal range
  • ESD >2000V per MIL-STD-883, Method 3015
  • >200V using
  • machine model (C = 200pF, R = 0)
  • Available in 56 pin TSSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74CBTLV16212PAG Active PAG56 TSSOP 56 I Yes Tube Availability
74CBTLV16212PAG8 Active PAG56 TSSOP 56 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
74CBTLV16212 Datasheet Datasheet PDF 99 KB Dec 3, 2014
PCNs & PDNs
PDN# L-05-04 Selective Logic Products Obsolescence Product Discontinuation Notice PDF 173 KB Apr 26, 2005
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 21, 2004
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) Product Change Notice PDF 22 KB May 23, 2004
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB Dec 12, 2005
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 Product Change Notice PDF 129 KB Sep 17, 2008
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 147 KB Jul 29, 2008

Software & Tools

Title Other Languages Type Format File Size Date
74CBTLV16212 Hspice Model Model - HSPICE ZIP 20 KB May 22, 2002
74CBTLV16212 IBIS Model Model - IBIS ZIP 9 KB Jan 22, 2003