Low-Voltage 10-Bit Bus Switch with Active High and Low Enables

The 74CBTLV3862 10-bit bus switch with active high/low enables, provides high-speed bus switching with low on-state resistance of the switch allowing connections to be made with minimal propagation delay. The 74CBTLV3862 operates at -40C to +85C

Features

  • 5 ohm A/B bi-directional switch
  • Isolation Under Power-Off Conditions
  • Over-voltage tolerant
  • Latch-up performance exceeds 100mA
  • VCC = 2.3V - 3.6V, normal range
  • ESD >2000V per MIL-STD-883, Method 3015
  • >200V using
  • machine model (C = 200pF, R = 0)
  • Available in 24 pin QSOP and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74CBTLV3862PGG Active PGG24 TSSOP 24 I Yes Tube Availability
74CBTLV3862PGG8 Active PGG24 TSSOP 24 I Yes Reel Availability
74CBTLV3862QG Active PCG24 QSOP 24 I Yes Tube Availability
74CBTLV3862QG8 Active PCG24 QSOP 24 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
74CBTLV3862 Datasheet Datasheet PDF 91 KB Dec 17, 2014
Errata LEN-02-02: OE Switching Characteristics Errata PDF 9 KB May 6, 2002
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PDN# : L-09-02 PRODUCT DISCONTINUANCE NOTICE Product Delete Notice PDF 70 KB Jul 20, 2009
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002

Software & Tools

Title Other Languages Type Format File Size Date
CBTLV3862 Hspice Model Model - HSPICE ZIP 17 KB Mar 19, 2001
CBTLV3862 IBIS Model Model - IBIS ZIP 8 KB Mar 24, 2002