3.3V 16-Bit Bus Switch for Hot Swap Applications

The QS32XVH2245 HotSwitch is a high bandwidth, 16-bit bus switch. The QS32XVH2245 is ideal for line matching and low noise environments. The switches can be turned ON under the control of the LVTTL-compatible Output Enable (OEx) signal for bidirectional data flow with no added delay or ground bounce. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS32XVH2245 ideal for hot-swapping applications. The QS32XVH2245 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC – Isolation under power-off conditions – No DC path to VCC or GND – 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • 25 ohm resistors for low noise and line matching
  • Available in 40-pin QVSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS32XVH2245Q2G Active DMG40 QVSOP 40 I Yes Tube Availability
QS32XVH2245Q2G8 Active DMG40 QVSOP 40 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS32XVH2245 Datasheet Datasheet PDF 262 KB Jun 13, 2011
Errata LEN-08-01 Errata PDF 65 KB Aug 17, 2008
Application Notes & White Papers
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
PCNs & PDNs
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 27, 2013
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z Product Change Notice PDF 12 KB Dec 9, 2001
PCN # L0306-02 Fab 2 to Fab 4 Transfer Product Change Notice PDF 96 KB Jul 2, 2003
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB Jul 31, 2002
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 23, 2006

Software & Tools

Title Other Languages Type Format File Size Date
QS32XVH2245 IBIS Model Model - IBIS ZIP 9 KB Dec 7, 2003
QS32XVH2245 Hspice Model Model - HSPICE ZIP 18 KB May 22, 2002