2.5V / 3.3V 20-Bit Dual Port, High Bandwidth Bus Switch

The QS3VH16862 HotSwitch with 20-bit dual port is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH16862 ideal for high performance communications applications. The QS3VH16862 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to Vcc
  • Isolation under power-off conditions
  • No DC path to Vcc or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • Vcc operation: 2.3V to 3.6V
  • High bandwidth - up to 500 MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 48 pin TSSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3VH16862PAG Obsolete PAG48 TSSOP 48 I Yes Tube Availability
QS3VH16862PAG8 Obsolete PAG48 TSSOP 48 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3VH16862 Datasheet Datasheet PDF 280 KB Jun 9, 2013
PCNs & PDNs
PDN# L-05-04 Selective Logic Products Obsolescence Product Discontinuation Notice PDF 173 KB Apr 26, 2005
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PDN# : CQ-15-04 Quarterly Market Declined PDN Product Discontinuation Notice PDF 545 KB Aug 12, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) Product Change Notice PDF 22 KB May 23, 2004
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB Dec 12, 2005
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 Product Change Notice PDF 129 KB Sep 17, 2008
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002

Software & Tools

Title Other Languages Type Format File Size Date
QS3VH16862 IBIS Model Model - IBIS ZIP 9 KB Dec 7, 2003
QS3VH16862 Hspice Model Model - HSPICE ZIP 24 KB May 22, 2002