QuickSwitch Products 3.3V 8-Bit Bus Switch for Hot Swap Applications

The QS3VH245 HotSwitch 8-bit bus switch is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The switches can be turned ON under the control of the LVTTL-compatible Output Enable signal for bidirectional data flow with no added delay or ground bounce. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH245 ideal forhigh performance communications applications. The QS3VH245 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 20 pin QSOP, SOIC, and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3VH245PAG Active PGG20 TSSOP 20 I Yes Tube Availability
QS3VH245PAG8 Active PGG20 TSSOP 20 I Yes Reel Availability
QS3VH245QG Active PCG20 QSOP 20 I Yes Tube Availability
QS3VH245QG8 Active PCG20 QSOP 20 I Yes Reel Availability
QS3VH245SOG Active PSG20 SOIC 20 I Yes Tube Availability
QS3VH245SOG8 Active PSG20 SOIC 20 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3VH245 Datasheet Datasheet PDF 272 KB Feb 23, 2014
Errata LEN-08-01 Errata PDF 65 KB Aug 17, 2008
User Guides & Manuals
FCT Bus Switch Cross Reference Guide Guide PDF 568 KB Aug 9, 2016
Application Notes & White Papers
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : A1509-03 Gold to Copper wire Product Change Notice PDF 31 KB Oct 14, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 7, 2002
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB Jul 31, 2002
PCN L0105-03: Die Revision Product Change Notice PDF 11 KB May 23, 2001

Software & Tools

Title Other Languages Type Format File Size Date
QS3VH245 IBIS Model Model - IBIS ZIP 9 KB Dec 7, 2003
QS3VH245 Hspice Model Model - HSPICE ZIP 18 KB May 22, 2002