The QS3126 provides a set of four high-speed CMOS switches connecting inputs to outputs. The low ON resistance of the QS3126 allows inputs to be connected to outputs without propagation delay and without generating additional ground bounce noise. The QS3126 is ideal for signal and control switching since the device adds no noise, ground bounce, propagation delay, or significant power consumption to the system. The QS3126 operates at -40C to +85C

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • Pin compatible with the 74'126 function
  • Undershoot clamp diodes on all switch and control inputs
  • Active high enabling
  • Hot-swapping, hot-docking
  • Voltage translation (5V to 3.3V)
  • Power conservation
  • Capacitance reduction and isolation (mass storage, work stations)
  • Logic replacement (data processing)
  • Clock gating
  • Bus isolation
  • Available in 16 pin QSOP and 14 pin SOIC packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3126QG Active PCG16 QSOP 16 C Yes Tube
Availability
QS3126QG8 Active PCG16 QSOP 16 C Yes Reel
Availability
QS3126S1G Active DCG14 SOIC 14 C Yes Tube
Availability
QS3126S1G8 Active DCG14 SOIC 14 C Yes Reel
Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3126 Datasheet Datasheet PDF 208 KB
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB
Quickswitch Basics Application Note PDF 83 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN# L0212-01 Fab Site Change to Fab 4 Product Change Notice PDF 50 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB

Software & Tools

Title Other Languages Type Format File Size Date
QS3126 IBIS Model Model - IBIS ZIP 10 KB