High-Speed CMOS QuickSwitch 8-Bit Bus Switch

The QS3244 provides a set of eight high-speed CMOS TTL-compatible bus switches in a pinout compatible with 74FCT244, 74F244, 74ALS/AS/ LS244 8-bit drivers. The low ON resistance (5 ohm) of the 3244 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The QS3244 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Hot-swapping, hot-docking
  • Voltage translation (5V to 3.3V)
  • Power conservation
  • Capacitance reduction and isolation
  • Clock gating
  • Bus switching and isolation
  • Available in 20 pin QSOP, SOIC, and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3244PAG Active PGG20 TSSOP 20 I Yes Tube Availability
QS3244PAG8 Active PGG20 TSSOP 20 I Yes Reel Availability
QS3244QG Active PCG20 QSOP 20 I Yes Tube Availability
QS3244QG8 Active PCG20 QSOP 20 I Yes Reel Availability
QS3244SOG Active PSG20 SOIC 20 I Yes Tube Availability
QS3244SOG8 Active PSG20 SOIC 20 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3244 Datasheet Datasheet PDF 212 KB Feb 13, 2011
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB May 31, 1996
AN-19: Space Reduction Via Placement Application Note PDF 41 KB May 31, 1996
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
Quickswitch Basics Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB May 31, 1996
PCNs & PDNs
PDN# L-05-04 Selective Logic Products Obsolescence Product Discontinuation Notice PDF 173 KB Apr 26, 2005
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PDN# Logic-00-09: Obsolete PDIP Package Product Discontinuation Notice PDF 73 KB Apr 23, 2001
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 24, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 7, 2002
PCN# L0212-01 Fab Site Change to Fab 4 Product Change Notice PDF 50 KB Dec 15, 2002

Software & Tools

Title Other Languages Type Format File Size Date
QS3244 Hspice Model Model - HSPICE ZIP 5 KB Jan 22, 2003
QS3244 IBIS Model Model - IBIS ZIP 8 KB Dec 7, 2003