High-Speed CMOS 20-Bit Bus Switch

The QS32X2384 provides a set of twenty high-speed CMOS TTLcompatible bus switches. The QS32x2384 also includes internal 25 ohm series termination resistors to reduce reflection noise in high-speed applications. Four Bus Enable signals are provided, one for each of five bits of the 20-bit bus. The QS32X2384 is ideal for switching wide digital buses, as well as hotplug buffering, and 5V to 3V conversion. The QS32X2384 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to VCC
  • Low propagation delay and zero ground bounce
  • 25 ohm resistors for low noise
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Four enables control five bits each
  • TTL-compatible input and output levels
  • Available in 48-pin QVSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS32X2384Q1G Active DJG48 QVSOP 48 I Yes Tube Availability
QS32X2384Q1G8 Active DJG48 QVSOP 48 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS32X2384 Datasheet Datasheet PDF 216 KB Feb 15, 2011
Errata LEN-02-01: pin swap Errata PDF 100 KB Apr 29, 2002
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB May 31, 1996
AN-19: Space Reduction Via Placement Application Note PDF 41 KB May 31, 1996
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
Quickswitch Basics Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB May 31, 1996
PCNs & PDNs
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 27, 2013
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 23, 2006