The QS3383 provides ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3383 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Bus exchange configuration allows byte swapping of buses in systems. It can also be used as a 5-wide 2-to-1 multiplexer and to create low delay barrel shifters, etc. The QS3383 operates at -40C to +85C.


  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero added ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Bus exchange allows nibble swap
  • Available in 24 pin QSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3383QG Active PCG24 QSOP 24 C Yes Tube
QS3383QG8 Active PCG24 QSOP 24 C Yes Reel

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3383 Datasheet Datasheet PDF 211 KB Oct 3, 2011
User Guides & Manuals
FCT Bus Switch Cross Reference Guide Guide PDF 568 KB Aug 9, 2016
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
Quickswitch Basics Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB May 31, 1996
AN-12: Using QuickSwitch to Make Dual Port RAMs Application Note PDF 58 KB May 31, 1996
AN-15: CMOS Cus Exchange Switches for Crossbars Application Note PDF 106 KB May 31, 1996
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB May 31, 1996
AN-19: Space Reduction Via Placement Application Note PDF 41 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB May 31, 1996
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges Product Change Notice PDF 39 KB Aug 29, 2018
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 24, 2005
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PDN# Logic-00-09: Obsolete PDIP Package Product Discontinuation Notice PDF 73 KB Apr 23, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB Jul 21, 2005

Software & Tools

Title Other Languages Type Format File Size Date
QS3383 Hspice Model Model - HSPICE ZIP 17 KB Jun 8, 2004
QS3383 IBIS Model Model - IBIS ZIP 10 KB Jun 8, 2004