High-Speed CMOS QuickSwitch 16:8 Multiplexer

The QS3390 provides a 16:8 multiplexer logic switch. The low ON resistance (5 ohm) of the QS3390 allows inputs to be connected to the outputs without adding propagation delay and without generating additional ground bounce noise. Mux/Demux devices provide an order of magnitude faster speed than equivalent logic devices. The QS3390 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 16:8 multiplexer function with zero delay
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Low power CMOS proprietary technology
  • Undershoot clamp diodes on all switch and control inputs
  • Direct bidirectional connection for mux
  • Available in 28 pin QSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3390QG Active PCG28 QSOP 28 I Yes Tube Availability
QS3390QG8 Active PCG28 QSOP 28 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3390 Datasheet Datasheet PDF 76 KB Oct 13, 2014
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
AN-19: Space Reduction Via Placement Application Note PDF 41 KB May 31, 1996
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB May 31, 1996
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
Quickswitch Basics Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB May 31, 1996
PCNs & PDNs
PCN# : TB1504-01R1 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 95 KB Oct 21, 2015
PCN# : TB1504-01 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 50 KB Jul 20, 2015
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 21, 2004
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# L0212-01 Fab Site Change to Fab 4 Product Change Notice PDF 50 KB Dec 15, 2002

Software & Tools

Title Other Languages Type Format File Size Date
QS3390 Hspice Model - HSPICE ZIP 6 KB Jan 22, 2003
QS3390 IBIS model Model - IBIS ZIP 4 KB Mar 24, 2002