The QS34X2245 provides a set of 32 high-speed CMOS compatible bus switches in a flow-through pinout. The low ON-resistance of the QS34X2245 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Internal 25 ohm resistors reduce reflection noise in high-speed applications. This device is ideally suited for 32/64 bit applications where board space is at a premium. The QS34X2245 operates at -40C to +85C.


  • Enhanced N channel FET with no inherent diode to Vcc
  • Bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Internal 25 ohm resistors for low noise
  • Flow-through pinout for easy layout
  • Undershoot clamp diodes on all switch and control inputs
  • TTL-compatible control inputs
  • Available in 80-pin MilliPaQ™ package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS34X2245Q3G Active DMG80 QVSOP 80 C Yes Tube
QS34X2245Q3G8 Active DMG80 QVSOP 80 C Yes Reel

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS34X2245 Datasheet Datasheet PDF 222 KB
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB
Quickswitch Basics Application Note PDF 83 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN# L0212-01 Fab Site Change to Fab 4 Product Change Notice PDF 50 KB
PCN #L0201-03R1 RON Specification Changes Product Change Notice PDF 87 KB
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB

Software & Tools

Title Other Languages Type Format File Size Date
QS34X2245 IBIS Model Model - IBIS ZIP 4 KB
QS34x2245 Hspice Model Model - HSPICE ZIP 6 KB