High-Speed 32-Bit Bus Exchange Switch in MillipaQ

The QS34X383 provides four sets of eight high-speed CMOS TTLcompatible bus switches. The low ON resistance (5 ohm) of the QS34X383 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The Bus exchange configuration allows byte swapping of buses in systems. It can also be used as a 16-bit 2-to-1 multiplexer and to create low delay barrel shifters, etc. The QS34X383 operates at -40C to +85C.

Features

  • 5 ohm switches connect inputs to outputs
  • Zero propagation delay
  • Direct bus connect
  • Live insertion capability
  • Low power CMOS proprietary technology
  • Bus exchange allows nibble swap
  • TTL-compatible control inputs
  • Available in 80-pin Millipaq package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS34X383Q3G Active DMG80 QVSOP 80 I Yes Tube Availability
QS34X383Q3G8 Active DMG80 QVSOP 80 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS34X383 Datasheet Datasheet PDF 226 KB Aug 14, 2012
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
AN-15: CMOS Cus Exchange Switches for Crossbars Application Note PDF 106 KB May 31, 1996
AN-19: Space Reduction Via Placement Application Note PDF 41 KB May 31, 1996
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB May 31, 1996
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB May 31, 1996
AN-12: Using QuickSwitch to Make Dual Port RAMs Application Note PDF 58 KB May 31, 1996
Quickswitch Basics Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB May 31, 1996
PCNs & PDNs
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 27, 2013
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 7, 2002
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 23, 2006

Software & Tools

Title Other Languages Type Format File Size Date
QS34X383 IBIS Model Model - IBIS ZIP 4 KB Jan 22, 2003
QS34X383 Hspice Model Model - HSPICE ZIP 6 KB Jan 22, 2003