The QS3861 provides a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance (5 ohm) of the QS3861 allows inputs to be connected without adding propagation delay and without generating additional ground bounce noise. The Bus Enable (BE) signal turns the switches on. The QS3861 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Available in 24 pin QSOP and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3861PAG Active PGG24 TSSOP 24 C Yes Tube
Availability
QS3861PAG8 Active PGG24 TSSOP 24 C Yes Reel
Availability
QS3861QG Active PCG24 QSOP 24 C Yes Tube
Availability
QS3861QG8 Active PCG24 QSOP 24 C Yes Reel
Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3861 Datasheet Datasheet PDF 213 KB
User Guides & Manuals
FCT Bus Switch Cross Reference Guide Guide PDF 568 KB
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB
Quickswitch Basics Application Note PDF 83 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCNs & PDNs
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges Product Change Notice PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB
Other
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB

Software & Tools

Title Other Languages Type Format File Size Date
QS3861 Hspice Model - HSPICE ZIP 6 KB
QS3861 IBIS Model Model - IBIS ZIP 4 KB