256K x 18 SuperSync FIFO, 3.3V

The 72V2105 is an 256K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.

Features

  • Pin-compatible with the 72V2x5 SuperSync FIFOs
  • 10ns read/write cycle time (6.5ns access time)
  • Fixed, low first word data latency time
  • 5V input tolerant
  • Auto power down minimizes standby power consumption
  • Retransmit operation with fixed, low first word data latency time
  • Empty, Full and Half-Full flags signal FIFO status
  • Programmable Almost-Empty and Almost-Full flags, Easily expandable in depth and width
  • Independent Read and Write clocks (permit reading and writing simultaneously)
  • Available in 64-pin TQFP and STQFP packages
  • Industrial temperature range (–40C to +85C) is available

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
72V2105L10PF Active PN64 TQFP 64 C No Tray Availability
72V2105L10PF8 Active PN64 TQFP 64 C No Reel Availability
72V2105L10PFG Active PNG64 TQFP 64 C Yes Tray Availability
72V2105L10PFG8 Active PNG64 TQFP 64 C Yes Reel Availability
72V2105L15PF Active PN64 TQFP 64 C No Tray Availability
72V2105L15PF8 Active PN64 TQFP 64 C No Reel Availability
72V2105L15PFGI Active PNG64 TQFP 64 I Yes Tray Availability
72V2105L15PFGI8 Active PNG64 TQFP 64 I Yes Reel Availability
72V2105L15PFI Active PN64 TQFP 64 I No Tray Availability
72V2105L15PFI8 Active PN64 TQFP 64 I No Reel Availability
72V2105L20PF Active PN64 TQFP 64 C No Tray Availability
72V2105L20PF8 Active PN64 TQFP 64 C No Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
72V295/72V2105 Datasheet Datasheet PDF 239 KB Aug 31, 2016
PCNs & PDNs
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB Aug 25, 2016
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB Dec 13, 2001
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notice PDF 252 KB Oct 18, 2006
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB May 9, 2006
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB Mar 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB Mar 19, 2003
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB Jul 18, 2005
Minor mask change to improve manufac. efficiency. Product Change Notice PDF 11 KB Feb 4, 2001
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB Jun 16, 2002
PCN# F0301-02: Die Shrink and Process Change Product Change Notice PDF 26 KB Mar 30, 2003

Software & Tools

Title Other Languages Type Format File Size Date
72V2105 IBIS Model - IBIS ZIP 9 KB Jun 12, 2000
72V2105 HSPICE Model - HSPICE TAR 49 KB Jun 28, 1999