The 5962-88740 (6116 SRAM) is organized as 2K x 8. This part offers a reduced power standby mode.This low-power version also offers a battery backup data retention capability where the circuit typically consumes only 1µW to 4µW operating off a 2V battery. All inputs and outputs are TTL-compatible. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.


  • High-speed access and chip select times – 25/35ns (max.)
  • Low-power consumption
  • Battery backup operation – 2V data retention voltage
  • Produced with advanced CMOS high-performance technology
  • CMOS process virtually eliminates alpha particle soft-error rates
  • Input and output directly TTL-compatible
  • Static operation: no clocks or refresh required
  • Available in 24-pin (300 mil) ceramic DIP package
  • Military product compliant to MIL-STD-833, Class B

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
5962-8874001LA Active SD24 CDIP 24 M No Tube
5962-8874002LA Active SD24 CDIP 24 M No Tube

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
6116SA_LA Data Sheet Datasheet PDF 82 KB Nov 5, 2014
PCN# : A1504-01 Change Silver Glass adhesive material Product Change Notice PDF 27 KB Apr 26, 2015
PCN# : A1503-01 New Die Coat Materials Product Change Notice PDF 24 KB Apr 11, 2015
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# : TB0911-02 LASER TOP MARK ON CERDIP 300 MILS, CERDIP 600 MILS, Product Change Notice PDF 85 KB Nov 11, 2009
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 24, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 Product Change Notice PDF 44 KB Oct 14, 2004
PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G Product Change Notice PDF 38 KB Mar 3, 2004
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN SR-0203-02 Wafer Fab Transfer, Fab 2 to Fab 4 Product Change Notice PDF 41 KB Mar 14, 2002
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999