3.3V 64K x 32 Synchronous PipeLined Burst SRAM

The 71V632 3.3V CMOS SRAM is organized as 64K x 32. The pipelined burst architecture provides cost-effective 3-1-1-1 secondary cache performance for processors up to 117MHz. The 71V632 SRAM contains write, data, address, and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

Features

  • High system speed 4.5ns clock access time (117 MHz)
  • Single-cycle deselect functionality (Compatible with
  • Micron Part # MT58LC64K32D7LG-XX)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte
  • write enable (BWE), and byte writes (BWx)
  • Power down controlled by ZZ input
  • Operates with a single 3.3V power supply (+10/-5%)
  • Available in 100-pin TQFP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
71V632S5PFGI Active PKG100 TQFP 100 I Yes Tray Availability
71V632S5PFGI8 Active PKG100 TQFP 100 I Yes Reel Availability
71V632S6PFGI Active PKG100 TQFP 100 I Yes Tray Availability
71V632S6PFGI8 Active PKG100 TQFP 100 I Yes Reel Availability
71V632S7PFG Active PKG100 TQFP 100 C Yes Tray Availability
71V632S7PFG8 Active PKG100 TQFP 100 C Yes Reel Availability
71V632S7PFGI Active PKG100 TQFP 100 I Yes Tray Availability
71V632S7PFGI8 Active PKG100 TQFP 100 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
71V632 Data Sheet Datasheet PDF 755 KB Feb 24, 2017
PCNs & PDNs
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB Aug 25, 2016
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB Dec 13, 2001
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB May 9, 2006
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN#:G-0303-01, new m/c G700 & 3230 d/a material Product Change Notice PDF 138 KB Mar 10, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB Mar 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB Mar 19, 2003
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB Jul 18, 2005
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB Jun 16, 2002

Software & Tools

Title Other Languages Type Format File Size Date
71V632_PF IBIS Model Model - IBIS ZIP 9 KB Aug 13, 2000
71V632 Verilog Model Model - Verilog ZIP 15 KB Aug 31, 1998