3.3V CMOS 16-Bit Bus Transceiver with 3-State Outputs

The 74ALVC162245 16-bit bus transceiver is designed for asynchronous communication between data buses and can be used as two 8-bit transceivers or one 16-bit transceiver. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. The 74ALVC162245 has series resistors in the device output structure of the "A" port which will significantly reduce line noise when used with light loads. The 74ALVC162245 operates at -40C to +85C

Features

  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using
  • machine model (C = 200pF, R = 0) VCC = 3.3V ± 0.3V, Normal Range
  • VCC = 2.7V to 3.6V, Extended Range
  • VCC = 2.5V ± 0.2V
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-Rail output swing for increased noise margin
  • Available in 48 pin TSSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74ALVC162245PAG Active PAG48 TSSOP 48 I Yes Tube Availability
74ALVC162245PAG8 Active PAG48 TSSOP 48 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB Jul 21, 2005
74ALVC162245 Datasheet Datasheet PDF 92 KB Jul 6, 2009
Application Notes & White Papers
AN-224: ALVC/LVC Logic Characteristics and Apps. Application Note PDF 204 KB Jul 5, 2005
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB Dec 13, 2001
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) Product Change Notice PDF 22 KB May 23, 2004
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB Dec 12, 2005
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 Product Change Notice PDF 129 KB Sep 17, 2008
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 147 KB Jul 29, 2008
PCN# L0110-04 Moisture Level Change From 1 to 3 Product Change Notice PDF 32 KB Oct 18, 2001

Software & Tools

Title Other Languages Type Format File Size Date
74ALVC162245 IBIS MODEL Model - IBIS ZIP 17 KB Feb 28, 1999
74ALVC162245 HSPICE MODEL Model - HSPICE ZIP 49 KB Mar 28, 1999