3.3V CMOS 16-Bit Buffer/Driver with 3-State Outputs and Bus-Hold

The 74ALVCH162244 16-bit buffer/driver is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The 74ALVCH162244 has "bus-hold" which prevents floating inputs and eliminates the need for pull-up/down resistors. The 74ALVCH162244 operates at -40C to +85C

Features

  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 33V ± 03V, Normal Range
  • VCC = 27V to 36V, Extended Range
  • VCC = 25V ± 02V
  • CMOS power levels (0.4 uW typ static)
  • Rail-to-Rail output swing for increased noise margin
  • Available in 48 pin TSSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74ALVCH162244PAG Active PAG48 TSSOP 48 I Yes Tube Availability
74ALVCH162244PAG8 Active PAG48 TSSOP 48 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
74ALVCH162244 Datasheet Datasheet PDF 90 KB Sep 19, 2016
Application Notes & White Papers
AN-224: ALVC/LVC Logic Characteristics and Apps. Application Note PDF 204 KB Jul 5, 2005
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB Dec 13, 2001
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) Product Change Notice PDF 22 KB May 23, 2004
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB Dec 12, 2005
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 Product Change Notice PDF 129 KB Sep 17, 2008
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB May 24, 2006
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB Apr 25, 2002
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 147 KB Jul 29, 2008
PCN# L0110-04 Moisture Level Change From 1 to 3 Product Change Notice PDF 32 KB Oct 18, 2001

Software & Tools

Title Other Languages Type Format File Size Date
74ALVCH162244 IBIS MODEL Model - IBIS ZIP 11 KB Feb 28, 1999
74ALVCH162244 HSPICE MODEL Model - HSPICE ZIP 49 KB Mar 28, 1999