3.3V Octal Buffer/Line Driver

The 74FCT3244 octal high-speed, low-power buffer/line driver is designed to be used as memory data and address drivers, clock drivers, and bus-oriented transmitter/receivers. The three-state controls are designed to operate these devices in a dual-nibble or single-byte mode. The 74FCT3244 operates at -40C to +85C

Features

  • Stnd and A speeds
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 3.3V ±0.3V, Normal Range
  • VCC = 2.7V to 3.6V, Extended Range
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-Rail output swing for increased noise margin
  • Available in 20 pin QSOP, SOIC, SSOP, and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74FCT3244APGG Active PGG20 TSSOP 20 I Yes Tube Availability
74FCT3244APGG8 Active PGG20 TSSOP 20 I Yes Reel Availability
74FCT3244APYG Active PYG20 SSOP 20 I Yes Tube Availability
74FCT3244APYG8 Active PYG20 SSOP 20 I Yes Reel Availability
74FCT3244AQG Active PCG20 QSOP 20 I Yes Tube Availability
74FCT3244AQG8 Active PCG20 QSOP 20 I Yes Reel Availability
74FCT3244ASOG Active PSG20 SOIC 20 I Yes Tube Availability
74FCT3244ASOG8 Active PSG20 SOIC 20 I Yes Reel Availability
74FCT3244PGG Active PGG20 TSSOP 20 I Yes Tube Availability
74FCT3244PGG8 Active PGG20 TSSOP 20 I Yes Reel Availability
74FCT3244PYG Active PYG20 SSOP 20 I Yes Tube Availability
74FCT3244PYG8 Active PYG20 SSOP 20 I Yes Reel Availability
74FCT3244QG Active PCG20 QSOP 20 I Yes Tube Availability
74FCT3244QG8 Active PCG20 QSOP 20 I Yes Reel Availability
74FCT3244SOG Active PSG20 SOIC 20 I Yes Tube Availability
74FCT3244SOG8 Active PSG20 SOIC 20 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
74FCT3244 Datasheet Datasheet PDF 51 KB Jul 31, 2017
Application Notes & White Papers
AN-124: 3.3V Logic Characteristics Application Note PDF 127 KB Dec 31, 1995
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB Oct 21, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB Jul 20, 2015
PDN# Logic-00-09: Obsolete PDIP Package Product Discontinuation Notice PDF 73 KB Apr 23, 2001
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 21, 2005
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 15, 2002
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil Product Change Notice PDF 223 KB Oct 5, 2006
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 3, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB Dec 13, 2004
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 1, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB Jan 24, 2005
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 2, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB Oct 9, 2003
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 21, 2004
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 17, 1999
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB Feb 7, 2002
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB Apr 13, 2003
PCN # L0307-02 Die Rev. change from PB to Z Product Change Notice PDF 96 KB Jul 31, 2003
PCN # L0203-09R2 Addendum Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 101 KB Aug 15, 2004
PCN# L0203-09R1 Tech Upgrade & Fab Transfer Product Change Notice PDF 98 KB May 28, 2003
PCN# : TB0808-04 QTY PER TUBE CHANGE FOR SSOP-20 Product Change Notice PDF 55 KB Oct 12, 2008

Software & Tools

Title Other Languages Type Format File Size Date
74FCT3244 Hspice Model Model - HSPICE ZIP 18 KB Jan 2, 2001
74FCT3244 IBIS Model Model - IBIS ZIP 7 KB Aug 31, 2000