Low Power, High Resolution 16-Bit Sensor Signal Conditioner

The ZSSC3026 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3026 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3026 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. Digital mating of the sensor with the signal conditioner is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines.

Features

  • Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
  • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
  • Internal auto-compensated temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain
  • Digital compensation of 1st and 2nd order temperature gain and offset drift
  • Intelligent power management unit
  • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly
  • Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 110 °C

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Range Carrier Type Buy Sample
ZSSC3026CC1B Active DICE WAFER 0 -40 to 85°C Wafer Availability
ZSSC3026CI1B Active DICE WAFER 0 -40 to 85°C Wafer Availability
ZSSC3026CI1D ES Active DICEW WAFER 0 -40 to 85°C Box Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
ZSSC3026 Short-form Datasheet Short Form Datasheet PDF 95 KB Apr 5, 2016
ZSSC3026 Datasheet Datasheet PDF 704 KB Apr 5, 2016
User Guides & Manuals
ZSSC30x6 Evaluation Kit Description Manual PDF 2.10 MB Apr 16, 2016
Application Notes & White Papers
IDT Wafer Dicing Guidelines Application Note PDF 44 KB Apr 16, 2016
Other
Sensor Signal Conditioning ICs for Industrial and Consumer Applications Overview PDF 6.88 MB Jul 14, 2017
The IDT Automotive Advantage Overview PDF 3.55 MB May 26, 2017
IDT CAD Altium Libraries for AID Products Rev 20160819 PCB Design Files ZIP 1.20 MB Aug 18, 2016

Software & Tools

Title Other Languages Type Format File Size Date
ZSSC3026 and ZSSC3036 Evaluation Kit Software Rev. 3.1_3026_3036 Software ZIP 8.10 MB Apr 5, 2016

Evaluation Boards

Part Number Title Sort ascending
ZSSC3026KIT Evaluation Kit for ZSSC3026