Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

The ZSSC3027 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3027 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as either I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3027 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3027 provides accelerated signal processing in order to support high-speed control, safety, and real-time sensing applications. It complements IDT's ZSSC30x6 products.


  • Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
  • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
  • Internal auto-compensated temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain as well as of 1st and 2nd order temperature gain and offset drift
  • Layout optimized for stacked-die bonding for high-density chip-on-board assembly
  • Typical sensor elements can achieve accuracy of better than ±0.10% full-scale output @ -40°C to 85°C

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Range Carrier Type Buy Sample
ZSSC3027AC1B Active DICE WAFER 0 -40 to 85°C Wafer Availability
ZSSC3027AC6B Active DICE WAFER 0 -40 to 85°C Wafer Availability
ZSSC3027AC7B Active DICE WAFER 0 -40 to 85°C Wafer Availability
ZSSC3027AI1B ES Preview DICE WAFER 0 Wafer Availability
ZSSC3027Al1D ES Preview DICE WAFER 0 -40 to 85°C Wafer Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
ZSSC3027 Short-form Datasheet Short Form Datasheet PDF 132 KB Apr 19, 2016
ZSSC3027 Datasheet Datasheet PDF 758 KB Apr 19, 2016
User Guides & Manuals
Choosing the Right Sensor Signal Conditioning IC Guide PDF 300 KB Sep 25, 2017
Application Notes & White Papers
IDT Wafer Dicing Guidelines Application Note PDF 44 KB Apr 16, 2016
IDT Sensing Solutions Overview 日本語 Overview PDF 1.15 MB May 31, 2017
Sensor Signal Conditioning ICs for Industrial and Consumer Applications Overview PDF 6.88 MB Jul 14, 2017
The IDT Automotive Advantage Overview PDF 3.55 MB May 26, 2017