The QS34XVH245 HotSwitch is a high bandwidth 32-bit bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The switches can be turned ON under the control of individual LVTTL-compatible Output Enable (OEx) signals for bidirectional data flow with no added delay or ground bounce. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS34XVH245 ideal for high performance communications applications. The QS34XVH245 operates from -40C to +85C.

特性

  • N channel FET switches with no parasitic diode to VCC – Isolation under power-off conditions – No DC path to VCC or GND – 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON , 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 80-pin QVSOP package

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active QVSOP 80 C 是的 Tube
Availability
Active QVSOP 80 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS34XVH245 Datasheet 数据手册 PDF 327 KB
Errata LEN-08-01 勘误表 PDF 65 KB
应用指南 &白皮书
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities 产品变更通告 PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire 产品变更通告 PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages 产品变更通告 PDF 102 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN # L0306-02 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 96 KB
PCN# L0206-11 ICCQ Max Limit Change 产品变更通告 PDF 9 KB
PCN# G0202-01, Alternate assembly facility 产品变更通告 PDF 16 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN L0105-03: Die Revision 产品变更通告 PDF 11 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
Downloads
QS34XVH245 IBIS Model 模型 - IBIS ZIP 9 KB
QS34XVH245 Hspice Model 模型 - HSPICE ZIP 18 KB