What are the thermal conductivity values of commonly used package materials?

Chip surface area and the thermal conductivity of the materials in the heat flow path have inverse relationship. Thermal conductivities of commonly used in package materials are listed in the table below. Refer to application note AN-842 for more details on thermal management and package material properties. For other questions not addressed by the Knowledge Base, plase submit a technical support request.

 

Documents

Title Other Languages Type Format File Size Date
Application Notes & White Papers
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 403 KB May 11, 2014