- Moisture sensitivity level with 260°C reflow profile
- Solderability test per J-STD-002B
- Following reliability tests:
- Preconditioning (260°C) + Autoclave (168hr)
- Preconditioning (260°C) + HAST (100hr)
- Preconditioning (260°C) + Temperature Cycle (-65°C to 150°C, 500 cycles for leadframe packages, -55°C to 125°C, 1000 cycles for BGA packages)
- High Temperature Storage (150°C for 1000hr)
For other questions not addressed by the knowledge base, please submit a technical support request.