The QS32X861 provides two sets of ten high-speed CMOS TTLcompatible bus switches. The low ON resistance of the QS32X861 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The QS32X861 bus switch is ideal for switching digital buses, as well as for hotplug buffering and 5V to 3V conversion. The QS32X861 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Available in 48-pin QVSOP package

Product Options

注文可能な製品ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type パッケージ 購入/サンプル
QS32X861Q1G Active QVSOP 48 C Yes Tube Package Info
Availability
QS32X861Q1G8 Active QVSOP 48 C Yes Reel Package Info
Availability

Documentation & Downloads

タイトル 他の言語 Type 形式 サイズ 日付
データシート
QS32X861 Datasheet Datasheet PDF 291 KB
アプリケーションノート、ホワイトペーパー
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 417 KB
Quickswitch Basics Application Note PDF 142 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN# L0203-10R2 Fab 2 to Fab4 Transfer Product Change Notice PDF 112 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
Downloads
QS32X861 IBIS Model Model - IBIS ZIP 4 KB
QS32X861 Hspice Model Model - HSPICE ZIP 6 KB