The 74LVC162244A 16-bit buffer/driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters and can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. All pins of the 74LVC162244A can be driven from either 3.3V or 5V devices which allows the use of the device as a translator in a mixed 3.3V/5V supply system. The 74LVC162244A operates at -40C to +85C

特長

  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 3.3V ± 0.3V, Normal Range
  • VCC = 2.7V to 3.6V, Extended Range
  • CMOS power levels (0.4 uW typ. static)
  • All inputs, outputs, and I/O are 5V tolerant
  • Supports hot insertion
  • Available in 48 pin SSOP, TSSOP, and TVSOP packages

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
Active TSSOP 48 C はい Tube
Availability
Active TSSOP 48 C はい Reel
Availability
Active SSOP 48 C はい Tube
Availability
Active SSOP 48 C はい Reel
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
74LVC162244A Datasheet データシート PDF 194 KB
アプリケーションノート、ホワイトペーパー
AN-224: ALVC/LVC Logic Characteristics and Apps. アプリケーションノート PDF 238 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities 製品変更通知 PDF 157 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 333 KB
PCN# : A1506-02 Gold wire to Copper wire 製品変更通知 PDF 35 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 291 KB
PCN# : A1504-04 Assembly Transfer from Amkor Philippines to OSE Taiwan 製品変更通知 PDF 484 KB
PDN# CQ-14-05 MARKET DECLINED PRODUCT DISCONTINUANCE NOTICE 製品中止通知 PDF 192 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 製品変更通知 PDF 129 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed 製品変更通知 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 製品変更通知 PDF 35 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) 製品変更通知 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 製品変更通知 PDF 116 KB
PCN#: A-0310-01, Green Products 製品変更通知 PDF 26 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material 製品変更通知 PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 製品変更通知 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound 製品変更通知 PDF 48 KB
PCN# G-0203-05 Mold Compound 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 製品変更通知 PDF 27 KB
PCN# G-0110-06 Mold Compound 製品変更通知 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 製品変更通知 PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change 製品変更通知 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. 製品変更通知 PDF 44 KB
Downloads
74LVC162244A HSPICE MODEL モデル-HSPICE ZIP 62 KB
74LVC162244A IBIS MODEL モデル-IBIS ZIP 10 KB