NOTICE - The following device(s) are recommended alternatives:
74FCT3807S - Low Skew 1 to 10 Clock Buffer
Improved jitter performance, smaller package

The FCT3807/A 3.3V clock driver is built using advanced dual metal CMOS technology. This low skew clock driver offers 1:10 fanout. The large fanout from a single input reduces loading on the preceding driver and provides an efficient clock distribution network. The FCT3807/A offers low capacitance inputs with hysteresis for improved noise margins. Multiple power and grounds reduce noise. Typical applications are clock and signal distribution.

特性

  • 0.5 MICRON CMOS Technology
  • Guaranteed low skew < 350ps (max.)
  • Very low duty cycle distortion < 350ps (max.)
  • High speed: propagation delay < 3ns (max.)
  • Very low CMOS power levels
  • TTL compatible inputs and outputs
  • 1:10 fanout
  • Maximum output rise and fall time < 1.5ns (max.)
  • Low input capacitance: 4.5pF typical
  • VCC = 3.3V ± 0.3V
  • Inputs can be driven from 3.3V or 5V components
  • Available in SSOP, SOIC, and QSOP packages

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active SSOP 20 C 是的 Reel
Availability
Active SSOP 20 I 是的 Reel
Availability
Active QSOP 20 C 是的 Reel
Availability
Active QSOP 20 I 是的 Reel
Availability
Active SOIC 20 C 是的 Reel
Availability
Active SOIC 20 I 是的 Reel
Availability
Active SSOP 20 C 是的 Tube
Availability
Active SSOP 20 C 是的 Reel
Availability
Active SSOP 20 I 是的 Tube
Availability
Active SSOP 20 I 是的 Reel
Availability
Active QSOP 20 C 是的 Tube
Availability
Active QSOP 20 C 是的 Reel
Availability
Active QSOP 20 I 是的 Tube
Availability
Active QSOP 20 I 是的 Reel
Availability
Active SOIC 20 C 是的 Tube
Availability
Active SOIC 20 C 是的 Reel
Availability
Active SOIC 20 I 是的 Tube
Availability
Active SOIC 20 I 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
74FCT3807 Datasheet 数据手册 PDF 168 KB
应用指南 &白皮书
AN-828 Termination - LVPECL 应用文档 PDF 322 KB
AN-845 Termination - LVCMOS 应用文档 PDF 146 KB
AN-844 Termination - AC Coupling Clock Receivers 应用文档 PDF 170 KB
AN-842 Thermal Considerations in Package Design and Selection 应用文档 PDF 495 KB
AN-840 Jitter Specifications for Timing Signals 应用文档 PDF 442 KB
AN-834 Hot-Swap Recommendations 应用文档 PDF 153 KB
AN-827 Application Relevance of Clock Jitter 应用文档 PDF 1.15 MB
AN-815 Understanding Jitter Units 应用文档 PDF 565 KB
AN-804 IDT Clock Buffers Offer Low Additive Phase Jitter 应用文档 PDF 246 KB
AN-805 Recommended Ferrite Beads 应用文档 PDF 121 KB
AN-150 Clock and Signal Distribution 应用文档 PDF 137 KB
IDT Clock Buffers Offers Ultra Low Additive Phase Jitter 应用文档 PDF 1.28 MB
AN-154: Estimating Power Dissipation in CMOS 应用文档 PDF 80 KB
AN-82 Clock Distribution with Guaranteed Skew 应用文档 PDF 214 KB
PCN / PDN
PCN# : A1809-02 Add Alternate Assembly Location on select Packages 产品变更通告 PDF 25 KB
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 产品变更通告 PDF 39 KB
PDN# : CQ-17-04(R1) Product Discontinuance Notice 产品停产通告 PDF 606 KB
PDN# : CQ-17-04 Product Discontinuance Notice 产品停产通告 PDF 599 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 291 KB
PCN# : A1208-01R1 Gold to Copper Wire 产品变更通告 PDF 254 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : TB0808-04 QTY PER TUBE CHANGE FOR SSOP-20 产品变更通告 PDF 55 KB
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil 产品变更通告 PDF 223 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs 产品变更通告 PDF 42 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP 产品变更通告 PDF 21 KB
PCN # L0203-09R2 Addendum Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 101 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN# L0203-09R1 Tech Upgrade & Fab Transfer 产品变更通告 PDF 98 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# G0202-01, Alternate assembly facility 产品变更通告 PDF 16 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
Downloads
74FCT3807 IBIS Model 模型 - IBIS ZIP 6 KB
74FCT3807 Hspice Model 模型 - HSPICE ZIP 14 KB
其他
Timing Solutions Products Overview 概览 PDF 4.11 MB
IDT Clock Generation Overview 日本語 概览 PDF 1.83 MB
IDT Clock Distribution Overview 日本語 概览 PDF 3.79 MB