The QS3VH257 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH257 ideal for high performance communication applications. The QS3VH257 operates from -40C to +85C.

特性

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 16 pin QSOP, SOIC, and TSSOP packages

产品选择

下单器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active TSSOP 16 C 是的 Tube
Availability
Active TSSOP 16 C 是的 Reel
Availability
Active QSOP 16 C 是的 Tube
Availability
Active QSOP 16 C 是的 Reel
Availability
Active SOIC 16 C 是的 Tube
Availability
Active SOIC 16 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS3VH257 Datasheet 数据手册 PDF 336 KB
Errata LEN-08-01 勘误表 PDF 65 KB
使用指南与说明
FCT Bus Switch Cross Reference Guide 指南 PDF 568 KB
应用指南 &白皮书
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
PCN / PDN
PCN# : A1905-01 Alternate Assembly Location & Change of Material Sets 产品变更通告 PDF 313 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN# : TB1403-01 Changed in Carrier Tape, Plastic Reel and Quantity per Reel on TSSOP-14, TSSOP-16 产品变更通告 PDF 663 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP 产品变更通告 PDF 21 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# L0206-11 ICCQ Max Limit Change 产品变更通告 PDF 9 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z 产品变更通告 PDF 12 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
Downloads
QS3VH257 IBIS Model 模型 - IBIS ZIP 9 KB
QS3VH257 Hspice Model 模型 - HSPICE ZIP 18 KB