• Moisture sensitivity level with 260°C reflow profile 
  • Solderability test per J-STD-002B 
  • Following reliability tests:
    • Preconditioning (260°C) + Autoclave (168hr) 
    • Preconditioning (260°C) + HAST (100hr) 
    • Preconditioning (260°C) + Temperature Cycle (-65°C to 150°C, 500 cycles for leadframe packages, -55°C to 125°C, 1000 cycles for BGA packages) 
    • High Temperature Storage (150°C for 1000hr)

For other questions not addressed by the knowledge base, please submit a technical support request.