Title Information
Package Name W8X8.64
Package Previous Code WDC
Package Description 8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan
Package Status Active
Package Type WLCSP-TCURDL
Class PLASTIC
Package Code WDC
Category PLASTIC
Lead Count 64
Pb (Lead) Free Yes
Length 4.03mm
Width 4.03mm
Thickness 0.6mm
Pitch 0.5mm
Pkg. Dimensions (mm) 4.03 x 4.03 x 0.60

Documentation

Title Other Languages Type Format File Size Date
Other
Package Drawing WLCSP-TCURDL 64pin W8X8.64 Package Outline Drawing PDF 160 KB