Title Information
Package Name W4X7.28
Package Previous Code WNZ
Package Description 4x7 28 Balls, 0.4mm Pitch, WLCSP; Unisem
Package Status Active
Package Type WLCSP-BP
Class PLASTIC
Package Code WNZ
Category PLASTIC
Lead Count 28
Pb (Lead) Free Yes
Length 2.86mm
Width 1.66mm
Thickness 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.86 x 1.66 x 0.50

Documentation

Title Other Languages Type Format File Size Date
Other
W4x7.28: 28 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) Package Outline Drawing PDF 170 KB