Title Information
Package Name W5X5.25H
Package Previous Code WPO
Package Description 25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status Active
Package Type WLCSP-BP
Class PLASTIC
Package Code WPO
Category PLASTIC
Lead Count 25
Pb (Lead) Free Yes
Length 2.07mm
Width 2.07mm
Thickness 0.28mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.07 x 2.07 x 0.28