The QS32XVH384 HotSwitch is a high bandwidth, 20-bit bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. Four banks of five switches are controlled by independent (xOE), LVTTL compatible signals for bidirectional data flow with no added delay or ground bounce. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS32XVH384 ideal for high performance communications applications. The QS32XVH384 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC – Isolation under power-off conditions – No DC path to VCC or GND – 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 48-pin QVSOP (S1) package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS32XVH384Q1G Active DJG48 QVSOP 48 C Yes Tube
Availability
QS32XVH384Q1G8 Active DJG48 QVSOP 48 C Yes Reel
Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS32XVH384 Datasheet Datasheet PDF 345 KB
Errata LEN-08-01 Errata PDF 65 KB
Errata LEN-02-01: pin swap Errata PDF 100 KB
PCNs & PDNs
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN # L0306-02 Fab 2 to Fab 4 Transfer Product Change Notice PDF 96 KB
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB
Other
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB