IDT’s JEDEC-compliant 4RCD0124K is a Gen 1 DDR4 registered clock driver (RDC) for Enterprise Class Server RDIMMs, LRDIMMs and UDIMMs operating with a 1.2V Vdd supply. It features a 32-bit 1:2 register command, address buffer with parity designed for 1.2V VDD operation.

Features

  • JEDEC Compliant RCD  
  • DDR4-1600/1866/2133/2400
  • Optimized for JEDEC DDR4 2400 MT/s RDIMM, LRDIMM and UDIMM
  • Designed to be used with IDT 4DB0226KA (DDR4 DB) and IDT TSE2004GB2 (DDR4 Temperature Sensor)
  • Supports CKE Power Down operation modes
  • Support Quad Chip Select Operation
    • Direct Dual CS Mode
    • Direct QuadCS Mode
  • Encoded QuadCS Mode
  • Pinout optimized DDR4 RDIMM, LRDIMM and UDIMM PCB layout
  • Provides access to internal control words for configuring the device features and adapting in different RDIMM and system applications
  • Available in 253-ball Dual-Pitch (0.50mm/0.65mm), 15 x 20 Grid , Rectangular Ball Grid Array Package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
4RCD0124KC0ATG Active ATG253 FCCSP 253 C Yes Tray
Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Application Notes & White Papers
IDT DDR4 LRDIMMs Let You Have It All 简体中文 White Paper PDF 1.08 MB
DDR4 LRDIMMs For Both Memory Capacity and Speed White Paper PDF 5.22 MB
PCNs & PDNs
PCN# A1901-01 : Assembly Sample Open/Short Test Introduced at Amkor and Stats Chippac, Korea Product Change Notice PDF 208 KB
PCN# : A1903-01 Add alternate bump location and Transfer Assembly Location Product Change Notification PDF 294 KB
PCN# : A1902-03 Add ASECL as an alternate assembly facility. Product Change Notification PDF 246 KB
PCN# : A1706-01 (R2) Change in Bumping Location on Select Packages Product Change Notice PDF 78 KB
PCN# : A1706-01 (R1) Change in Bumping Location on Select Packages Product Change Notice PDF 77 KB
PCN# : A1706-01 Change in Bumping Location on Select Packages Product Change Notice PDF 32 KB
PCN# : A1409-02 Alternate Bump and Assembly Location FCCSP-253 Product Change Notice PDF 25 KB
PCN# : TB1407-02 Alternate Test and Backend Location Product Change Notice PDF 22 KB
Other
Memory Interface Products Family Overview 简体中文 Overview PDF 515 KB